Back-end semiconductor process: back-grinding, dicing, packaging tips into tray
You can order even one piece of prototype wafer for your project.
Utilizing our technology accumulated over decades, we provide you with high-quality and reliable after-follow suitable for your needs. We offer you IC wafer back-end process, back-grinding, dicing, packaging tips into tray and so forth, as contract processing. Stable quality for thinner tips can be guaranteed by Dicing Before Grinding (DBG) process. We would also propose you new ideas including fabrication of components with silicon tips by our internal teamwork. Recently we are taking on the challenging materials like SiC power semiconductor, too.
It is our pleasure if our technology can be a help for your product development, trial production, design review, and condition setting with new materials of next generation. Feel free to contact us.